Precision Cutting Blades for the Electronics Industry
The electronics manufacturing sector demands ultra-precise cutting solutions for materials like PCBs, ceramic substrates, thin films, and semiconductor wafers. Our high-tech industrial blades enable micron-level accuracy, clean cuts, and exceptional durability, ensuring optimal yield rates and production efficiency. Below, we detail our specialized cutting tools for electronics applications:
MAIDECAL : Industrial Blades for Electronic Components
Our cutting blades serve critical functions across PCB fabrication, semiconductor processing, and electronic component production, including:
- PCB Cutting Blades – For clean routing of FR4, Rogers, and polyimide substrates without delamination.
- Electronic Ceramic Cutting Blades – Precision dicing of alumina/zirconia substrates (IoT sensors, insulators).
- Thin-Film Scribing Knives – Laser-free patterning of flexible circuits & OLED displays.
- Precision Punching Blades – Micro-hole drilling for connectors and EMI shielding cans.
- Wafer Dicing Blades – Low-Kerf silicon & sapphire wafer separation (≤0.1mm chipping).
- Cable Stripping Knives – Non-destructive insulation removal for high-frequency coaxial cables.
These tools help reduce scrap rates ≤0.5% while maintaining ±5µm cutting tolerances, critical for miniaturized electronics.

Technical Features & Industry Advantages
Our electronics-grade blades outperform competitors through:
- Nanoscale Edge Sharpness – 0.05µm surface finish prevents microcracks in brittle materials.
- Anti-Static Coatings – Conductive PVD layers dissipate ESD risks during IC packaging.
- Ultra-Hard Materials – Polycrystalline diamond (PCD) & tungsten carbide for 50x lifespan vs. HSS.
- Thermal Stability – Low-CTE alloys maintain dimensional accuracy in high-temp processes.
- Custom Tooth Profiles – Asymmetric serrations for vibration-free cutting at 20,000 RPM.
Results: 30% higher throughput and ≤0.1% defect rates in high-volume PCB/SiC wafer lines.
Material Science & Engineering Specifications
Blade Materials for Electronics Manufacturing
Material | Best For | Key Properties |
---|---|---|
Diamond-Coated TC (Tungsten Carbide) | SiC/GaN wafers, ceramic substrates | 90+ HRC hardness, < 1µm edge radius |
Polycrystalline Diamond (PCD) | PCB depaneling, flex circuits | 5,000+ operating hours, zero chipping |
Ceramic-Matrix Composites | Thin-film scribing | Anti-galling, chemical inertness |
Nano-Grained HSS | Precision punching dies | Fatigue-resistant, 62 HRC core hardness |
Precision Manufacturing Process
- Laser Ablation Shaping – Submicron edge geometry control (±2µm).
- Ion Beam Polishing – Atomically smooth cutting faces (Ra ≤0.01µm).
- Cryogenic Tempering – Stress relief for warp-free performance.
Blade Types & Configurations
Type | Critical Specs | Applications |
---|---|---|
Diamond Hub Blades | 0.1–0.3mm thickness, 50–300mm OD | Wafer dicing, LED separation |
Ultra-Thin PCB Routers | 0.5–1.0mm kerf, 45° chamfer edge | FR4/PI board cutting |
Toothed Slicing Blades | 100–500 teeth, negative rake angle | Laminate trimming |
Type | Critical Specs | Applications |
---|---|---|
Guillotine Cutters | 0.01mm flatness, mirror finish | Ceramic substrate singulation |
Flying Knives | 0.005mm runout at 15,000 RPM | Continuous flex circuit slitting |
Micro-Punch Blades | 0.2–3.0mm punch diameter | Connector pin shaping |
Type | Critical Specs | Applications |
---|---|---|
Laser-Assisted Cutters | Integrated cooling channels | CFRP antenna trimming |
Tapered Scribing Tools | 15°–45° edge angles | Thin-film solar cell patterning |
Hexagonal Dicing Knives | 6 cutting facets | 3D NAND stack separation |
MAIDECAL can customize various processing blades. Below are some image details:
Products include but are not limited to:
- Adhesive blade
- Slitting blade
- Diamond abrasive cutting knives
- Marking machine blades
- PCB cutting knives
- Electronic thin-film scribing knives
- Precision punching cutters
- Electronic ceramic cutting knives
- Electronic plastic housing cutting knives
- Ceramic robotic arm
Stock Availability & Fast Delivery
- 2000+ in-stock blades for immediate shipping
- 20-day standard lead time for custom orders
- Global logistics network (US, EU, Asia)
Customization Services
We engineer application-specific solutions, including:
- Material Optimization – Match substrates (FR4, AlN, LTCC).
- Coating Selection – TiN, DLC, or conductive treatments.
- Machine Integration – Compatible with Disco, Totech, LPKF systems.
Why MAIDECAL Blades Excel in Electronics
- Class 100 cleanroom packaging for contamination control.
- 30% longer tool life vs. industry averages.
- ISO 9001/IATF 16949 certified production.