Precision Cutting Blades for the Electronics Industry

The electronics manufacturing sector demands ultra-precise cutting solutions for materials like PCBs, ceramic substrates, thin films, and semiconductor wafers. Our high-tech industrial blades enable micron-level accuracy, clean cuts, and exceptional durability, ensuring optimal yield rates and production efficiency. Below, we detail our specialized cutting tools for electronics applications:

MAIDECAL : Industrial Blades for Electronic Components

Our cutting blades serve critical functions across PCB fabrication, semiconductor processing, and electronic component production, including:

These tools help reduce scrap rates ≤0.5% while maintaining ±5µm cutting tolerances, critical for miniaturized electronics.

Technical Features & Industry Advantages

Our electronics-grade blades outperform competitors through:

Results: 30% higher throughput and ≤0.1% defect rates in high-volume PCB/SiC wafer lines.

Material Science & Engineering Specifications

Blade Materials for Electronics Manufacturing

MaterialBest ForKey Properties
Diamond-Coated TC (Tungsten Carbide)SiC/GaN wafers, ceramic substrates90+ HRC hardness, < 1µm edge radius
Polycrystalline Diamond (PCD)PCB depaneling, flex circuits5,000+ operating hours, zero chipping
Ceramic-Matrix CompositesThin-film scribingAnti-galling, chemical inertness
Nano-Grained HSSPrecision punching diesFatigue-resistant, 62 HRC core hardness

Precision Manufacturing Process

Blade Types & Configurations

TypeCritical SpecsApplications
Diamond Hub Blades0.1–0.3mm thickness, 50–300mm ODWafer dicing, LED separation
Ultra-Thin PCB Routers0.5–1.0mm kerf, 45° chamfer edgeFR4/PI board cutting
Toothed Slicing Blades100–500 teeth, negative rake angleLaminate trimming
TypeCritical SpecsApplications
Guillotine Cutters0.01mm flatness, mirror finishCeramic substrate singulation
Flying Knives0.005mm runout at 15,000 RPMContinuous flex circuit slitting
Micro-Punch Blades0.2–3.0mm punch diameterConnector pin shaping
TypeCritical SpecsApplications
Laser-Assisted CuttersIntegrated cooling channelsCFRP antenna trimming
Tapered Scribing Tools15°–45° edge anglesThin-film solar cell patterning
Hexagonal Dicing Knives6 cutting facets3D NAND stack separation

MAIDECAL can customize various processing blades. Below are some image details:

Products include but are not limited to:

Stock Availability & Fast Delivery

Customization Services

We engineer application-specific solutions, including:

Why MAIDECAL Blades Excel in Electronics

Contact our engineering team for a free cutting solution analysis!